Topic 13 – HT-CMC Joining and Integration issues
Joining and integration issues of CMCs are subject of intense research worldwide, in particular now that CMCs are widely used as structural materials not only for aerospace, but also for commercial aircraft engines, car brakes, key components for energy production, and much more. For some HT applications, the existing CMC joining and integration options may be not suitable. In addition, several joining materials proposed for CMCs have not been properly tested at HT.
The aim of this symposium is to gather expert on these topics, from industry and academia, in order to discuss potential solutions and enable the fabrication and utilization of CMC components for high temperature structural applications. Joining and integration of CMCs include: adhesives, brazing, glass-sealing, diffusion bonding, transient liquid phase bonding, and surface engineering to increase the bon strength.
Reliable methods to test joint strength will also be part of this symposium.
Proposed sub-topics:
- Joining of CMCs and multimaterials
- Joining of CMCs at the nano- and micro-scales
- Design and modeling of CMC joints and interfaces
- Mechanical testing of CMC joined components
- High temperature wetting of CMCs by metals
- Environmental resistance (high temperature, oxidation etc.) of CMC joints
- Nondestructive evaluation technique of CMC joints
- Constructional design issues of CMC joining
- Non-conventional joining methods including flash joining, plasma assisted joining, electrochemical joining and cold joining (T<300 ˚C)
Scientific Committee:
- Ch. Lorrette (CEA-France)
- K. Lambrinou (SCK CEN- Belgium)
- S. Grasso (Southwest Jiaotong University-China)
- P. Tatarko (Institute of Inorganic Chemistry, Slovak Academy of Sciences; IIC SAS-Slovakia)
- V. Casalegno (POLITO-IT)
- L. Goglio (POLITO-IT)
- M. Herrmann (TU Dresden-DE)
- Th. Weissgaerber (Fraunhofer IFAM Dresden, DE)
- T. Koyanagi (ORNL-USA)
- T. Hinoki (Kyoto Univ. -Japan)
- H.P. Martin (IKTS-Fraunhofer-Germany)
- J. Wang (Shenyang National Laboratory for Materials Science, Chinese Academy of Sciences-China)
- C. Henager (PNNL-USA)
- T. Nozawa (Rokkasho Fusion Institute-Japan)
- M. Halbig (NASA-USA)
- J. Barcena (Tecnalia, Spain)
Point of contact:
Milena Salvo, Politecnico di Torino, Italy
E-mail: milena.salvo@polito.it